Toshiba Memory America is announcing that they have begun sampling of their new Automotive UFS embedded memory devices that support JEDEC specification ver. 2.1 HS-G3. This latest automotive UFS memory joins TMA’s Automotive e-MMC family of products to diversify their automotive product offerings. As the widespread adoption of entertainment and information systems continues, the market for applicable memory devices also …
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SK Hynix Announces Next-Generation 64GB UFS (Universal Flash Storage) 2.0 Solution Based On Their Own 16nm NAND
SK Hynix, Inc., a world-leading producer of NAND flash solutions, is announcing development of a UFS (Universal Flash Storage) 2.0 solution that is based on their own 16nm NAND Flash memory, as well as a proprietary controller and in-house firmware. This new UFS 2.0 solution offers a groundbreaking increase in performance, enabling the High-Speed Gear 3 Interface (up to 5.8 …
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