The name KIOXIO is very new to some. Mark my words; this will change. The name is a combination of the Japanese word… Kioku (Memory) and the Greek word ‘Axia’ which means ‘value’. As unfamiliar as you may be with the name, I would bet that you own something with KIOXIA memory in it. Maybe its a cell phone, automobile …
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Toshiba Memory Announces PCIe 4.0 SSDs and demonstrates Market’s First Enterprise/ Data Center PCIe 4.0 SSDs AT FMS 2019
Toshiba Memory utilized Flash Memory Summit 2019 for several key announcements regarding PCIe 4.0 SSDs, including their Next-Gen enterprise and data center NVMe drives and additional form factors. Toshiba Memory is also the first to announce and publicly demonstrate (along with Broadcom), their PCIe 4.0 NVMe SSDs. The Toshiba Memory CM6 and CD6 are enterprise / data center SSDs that …
Read More »Toshiba Introduces XFMEXPRESS™ – A New Form Factor, Innovative Connector, and Mobile-Friendly Footprint
Toshiba Memory America is utilizing Flash Memory Summit 2019 to introduce their new XFMEXPRESS™ Technology for removable PCIe attached, NVMe memory devices. XFMEXPRESS features a new form factor and a new innovative latching connector that greatly enhances serviceability and upgrade opportunities. Toshiba utilized their extensive background in single-package memory designs to develop XFMEXPRESS, with features that are designed to revolutionize …
Read More »Toshiba Announces XG6-P NVMe SSD – Industry’s Most Advanced Flash Node and up to 2TB of Capacity– Computex 2019 Update
Toshiba Memory America is kicking off their Computex 2019 presence by announcing the XG6-P NVMe SSD, building on the XG6 series that features class-leading write performance. Toshiba is gearing the new XG6-P towards high-end gaming systems and workstations, as well as for cost-optimized data center usage. The XG6-P series facilitates enhanced data access and application performance by virtue of its …
Read More »Toshiba Announces BG4 1TB Single Package PCIe Gen3 x4L SSDs Featuring 96-Layer BiCS FLASH™ 3D Memory — CES 2019 Update
Welcome to our 2019 coverage of the ever-impressive Consumer Electronics Show in Las Vegas. The first news to hit the pipeline is Toshiba announcing their BG4 series of ball grid array (BGA) solid-state drive (SSD). Toshiba’s ultra-compact NVMe™ SSDs pair both the flash and an all-new controller into a single package, creating design flexibility that is ideal for ultra-thin PC …
Read More »Toshiba Announces XG6 NVMe SSD – Industry’s First SSD Utilizing 96-Layer 3D NAND
Toshiba Memory is announcing a new series of solid-state drives (SSDs) that utilize Toshiba’s new 96-layer, BiCS FLASH™ 3D NAND. The new XG6 series are the first to use this breakthrough technology, and are geared toward client PC, high-performance mobile computing, gaming and embedded usage applications. The XG6 series are also a good fit for data center applications, including as …
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