Samsung Electronics Co., Ltd., a global leader in developing advanced memory technology, is announcing that it has begun mass production of the industry’s first 128GB ultra-fast embedded memory for next-generation high-end smartphones. The new embedded memory is based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard, which is the most advanced JEDEC-compliant next-generation flash memory storage interface specification in …
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Samsung Announces Mass Production Of High-Density ePoP Memory For Smartphones
Samsung Electronics Co., Ltd., a world-leading producer of advanced memory technology devices, is announcing that it has begun mass production of the industry’s first ePoP (embedded package on package) memory. This is a single memory package with 3GB of LPDDR3 (low power double data rate 3), 32GB of eMMC (embedded multi-media card) and a controller. Samsung’s latest ePoP is designed …
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