Welcome to our 2019 coverage of the ever-impressive Consumer Electronics Show in Las Vegas. The first news to hit the pipeline is Toshiba announcing their BG4 series of ball grid array (BGA) solid-state drive (SSD). Toshiba’s ultra-compact NVMe™ SSDs pair both the flash and an all-new controller into a single package, creating design flexibility that is ideal for ultra-thin PC …
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Toshiba Announces BG3 SSD Series Featuring Single Package BGA 64-Layer BiCS 3D Flash Memory
Toshiba is announcing its newest client SSD product that features their latest 64-layer TLC BiCS Flash memory on a single-package ball grid array. The new BG3 series is geared toward future mobile devices, and offers superior performance in a smaller footprint than SATA SSDs. Its DRAM-less design also reduces the cost and power requirements to enable higher quality user experiences. …
Read More »Toshiba Announces New BG SSDs With TLC BiCS Flash In World’s Smallest Form Factor
Toshiba America Electronic Components, Inc., a world-leading producer of storage technology and devices, is announcing that it will be showcasing its new BG series of solid-state drives (SSDs) featuring cutting-edge BiCS FLASH™ with TLC technology and Toshiba’s new single-package ball grid array (BGA) NVMe PCIe Gen3 x2 SSD at the 2016 Flash Memory Summit in Santa Clara, CA from 8/8 …
Read More »Samsung Producing World’s Smallest 512GB NVMe SSD – Its a Game Changer
Samsung Electronics Co., Ltd., world-leading producer of advanced memory devices, is announcing that it has begun mass production of the industry’s first NVMe PCIe solid-state drive (SSD) in a single ball grid array (BGA) package, to be used in next-generation PCs and ultra-slim notebook PCs. The new BGA NVMe SSD is dubbed PM971-NVMe and features an extremely compact package that …
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