SK Hynix is announcing development of the industry’s first 72-layer 3D TLC NAND in 256Gb density. Each 256Gb NAND flash chip represents 32GB of storage. SK Hynix launched their 36-layer (128Gb) NAND chips in April of 2016, followed by mass production of 48-layer (256Gb) 3D NAND chips beginning in November of 2016. A mere 5 months later, SK Hynix is …
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