Tag Archives: 32-layer NAND

Micron Technology, Inc., and Intel Corporation are announcing availability of their new 3D NAND technology, currently the world’s highest-density flash memory. This enables development of computing devices with significantly increased storage capacity, including for laptops, datacenters, and virtually every mobile device, such as tablets and smartphones. This latest 3D NAND technology was a collaborative development between Intel and Micron, and …

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