Samsung is announcing an 800GB SSD, designated as the SZ985 Z-SSD™, geared toward the most advanced enterprise applications. This includes the rapidly growing fields of Artificial Intelligence (AI), Internet of Things (IoT) and supercomputing. The 800GB Z-SSD was developed in 2017, providing the most efficient storage solution for these type of applications, as well as those that utilize high-speed data …
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ATP Announces NVMe M.2 Industrial SSDs with iTemp Support
ATP Electronics is announcing the implementation of industrial temperature (iTemp) support for its latest NVMe M.2 SSD modules. These latest SSD modules support a wide temperature range (-40°C to 85°C) to effectively mitigate heat and power issues associated with fanless embedded systems, as well as for extreme temperature variations in Internet of Things (IoT) applications, offering reliable performance even in …
Read More »Transcend Announces New Series of 3D TLC SSDs for Embedded Applications
Transcend is announcing release of a new series of 2.5” and M.2 form factor industrial SSDs featuring 3D TLC NAND flash memory. The performance of 3D TLC NAND is comparable to that of Planar (2D) MLC NAND, yet at a more competitive price point. This newest series of industrial SSDs also features SLC caching, a RAID engine, low-density parity check …
Read More »Mushkin Announces Significantly Expanded Product Lineup – CES 2018 Update
Mushkin took advantage of CES 2018 to announce a major expansion of their product offerings in several categories: HELIX-L M.2 2280 PCIe SSD The Helix-L M.2 2280 PCIe SSD is a dram-less build that helps keep the cost in line. It is offered in capacities ranging from 120GB to 1TB, and features a Silicon Motion SM2263XT controller to deliver sequential …
Read More »EDGE Memory Debuts CLX600 SSD in Various Form Factors and NextGen M.2 2280 PCIe SSD — CES 2018 Update
EDGE Memory is debuting a new series of SSDs at CES 2018. The CLX600 line is being offered in M.2 2280, mSATA and 1.8″ SATA 6Gb/s versions. The combination of performance, low power consumption and reliability make it an excellent choice for system integrators. The CLX600 utilizes high quality NAND Flash paired with a Silicon Motion controller to achieve transfer …
Read More »Western Digital Displays New WD and SanDisk Products — CES 2018 Update
Western Digital is utilizing CES 2018 to announce several new products, under both the WD and SanDisk brands. These new solutions help consumers to gather, share, preserve and access their files, photos and videos. Today’s data-driven life includes rich content from drones, action cameras, smartphones and even VR headsets. The first announcement is of the SanDisk Ultra Fit 256GB USB …
Read More »Phison Hits the Ground Running With Several New NAND Controller Offerings — CES 2018 Update
Phison has come to CES 2018 ready to take full advantage of the continued growth in the need for flash storage in the ever-evolving computing and mobile device markets. They are announcing a number of new products and features at this year’s show. Phison is announcing the addition of Thunderbolt connectivity to its line of E7 and E8 controllers. The …
Read More »Patriot Announces EVLVR Thunderbolt™ 3 Portable SSD — CES 2018 Update
Patriot is debuting their latest evolution in SSD technology at CES 2018. The EVLVR Thunderbolt™3 is a portable SSD that delivers 3 times the transfer speeds of traditional external SSDs. The EVLVR utilizes Phison’s E8 PCIe controller and Thunderbolt 3 connectivity to deliver sequential read speeds of up to 1500MB/s, and sequential write speeds of up to 1000MB/s. Thunderbolt 3 …
Read More »Toshiba Announces RC100 Mainstream NVMe M.2 SSD — CES 2018 Update
Toshiba Memory Corporation is starting off its CES 2018 presence by announcing its latest NVMe M.2 SSD, designated as the RC100 Series. This new SSD offering from Toshiba is geared toward mainstream users, including retail, system integrators and channel markets. The RC100 Series features Toshiba’s own 64-layer, 3-bits-per-cell TLC (triple-level cell) BiCS FLASH™ combined with an in-house developed controller in …
Read More »Toshiba Memory America Begins Sampling New Automotive UFS Embedded Memory Solutions
Toshiba Memory America is announcing that they have begun sampling of their new Automotive UFS embedded memory devices that support JEDEC specification ver. 2.1 HS-G3. This latest automotive UFS memory joins TMA’s Automotive e-MMC family of products to diversify their automotive product offerings. As the widespread adoption of entertainment and information systems continues, the market for applicable memory devices also …
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