Microsemi is announcing that its family of 12Gb/s SAS/SATA host bus adapters (HBAs) are now compatible with AMD’s EPYC™ series of processors. This applies to the Microsemi Adaptec HBA 1100, the SmartHBA 2100 and the SmartRAID 3100 series of HBAs. Data center customers utilizing AMD EPYC processors and looking for a storage adapter solution can utilize Microsemi’s full lineup of …
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Marvell Announces Industry First NVMe Chipset Solutions for Data Center SSD Applications
Marvell is announcing the launch of several innovative NVMe-based chipset solutions that will accelerate time from development to market for application-optimized SSD deployments in data centers. Marvell’s newly-developed and highly versatile devices can be tailored to specific cloud and enterprise workload requirements, improving capacity, performance, latency, power requirements and cost. The continued growth of cloud services and new technologies, such …
Read More »Nimbus Data Announces World’s Largest SSD at 100TB! – Powering Data-Driven Innovation!
Nimbus Data is announcing the ExaDrive® DC100 – the largest capacity of solid-state drive ever produced at 100TB! This represents more than 3 X the capacity of the nearest competitors, and the ExaDrive DC100 also consumes 85% less power per terabyte (TB). Nimbus Data’s innovations have reduced total cost of ownership per terabyte by 42% as compared to competitors’ enterprise …
Read More »Toshiba Announces KumoScale Storage Software for Cloud Applications
Toshiba is utilizing the 2018 Open Compute Project (OCP) U.S. Summit to announce general availability of their new KumoScale™ storage software for cloud applications. This new NVMe-oF™ (NVM Express™ over Fabrics) shared accelerated storage software enables the use of NVMe-oF to make flash storage accessible over a data center network, providing a simplified, flexible abstraction of physical disks into a …
Read More »Toshiba Announces New Data Center SSDs Featuring BiCS FLASH™ 64-Layer 3D NAND
Toshiba Memory America is announcing expansion of its portfolio of SSDs for data centers with the addition of new PCIe NVMe and SATA SSDs that feature Toshiba BiCS FLASH 64-layer TLC 3D NAND in several form factors. Their new CD5, XD5 and HK6-DC SSDs provide robust performance and reliability for read-intensive usage scenarios such as streaming media, big data analytics …
Read More »Sonnett Technologies Begins Shipping 1TB Fusion™ Thunderbolt™ PCIe Flash Drive
Sonnett Technolgies is announcing that they have begun shipping a new 1TB version of their popular Fusion™ Thunderbolt™ 3 PCIe Flash Drive. This is a ruggedized and pocket-sized solid-state storage device (SSD) that utilizes a Thunderbolt 3 interface and leverages the 40Gb/s bandwidth of Thunderbolt 3 to deliver sequential read speeds of up to 2600MB/s, and sequential write speeds of …
Read More »Samsung Announces Mass Production of 30.72TB SSD – Industry’s Largest Capacity for Next-Generation Enterprise Use
Samsung is announcing that it has begun mass production of their PM1643 30.72TB SAS SSD, the industry’s largest capacity SSD for next-generation enterprise systems. Samsung’s latest breakthrough technology is created by combining 32 of Samsung’s newest 1TB NAND flash packages. Each package consists of 16 stacked layers of 512Gb V-NAND chips. The super-density 1TB packages allow for a massive amount …
Read More »Intel Announces New 3D NAND Data Center SSDs
As the world’s stockpile of data continues to grow, Intel continues to bring to market industry-leading storage and memory products, pushing both form factor innovation and ever-increasing capacity. Intel’s latest data center offerings, the SSD DC P4510 and P4511 series, are reimagining how data is store for data centers. With the creation of interesting new form factors, such as the …
Read More »Silicon Power Announces Their First PCIe SSDs for Consumers and Enterprise
Silicon Power is announcing its first foray into PCIe SSDs, with the launch of the P32A80 and the P32A85. These new PCIe SSDs are geared toward high-end systems and offer new levels of responsiveness and performance, making them ideal for large image rendering and intensive graphics editing, musicians needing high volume storage and music library loading, and enterprises that demand …
Read More »Samsung Announces Mass Production of 256GB Embedded UFS (eUFS) for Automotive Applications
Samsung is announcing that it has begun mass production of a 256GB embedded Universal Flash Storage (eUFS) device that contains the advanced features for automotive specifications that meet the JEDEC UFS 3.0 standard, which is a first for the industry. Samsung introduced the breakthrough 128GB eUFS back in September of 2017, which was also an industry first. The new 256GB …
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